• EN
LED STRIP
COB Flex

COB strips are fixed directly on the PCB through solder paste using flip-chip, which shortens the heat dissipation path. The heat emitted by the LED chips is spread to the PCB through the solder paste directly which make the heat dissipation effect much better than the normal SMD strips, with a maximum 180 ° viewing angle to achieve more continuous and dot-free light.

place an order
  • Dimension


    Product advantages

     1. Our COB strips are fixed directly on the light strip substrate through solder paste using flip-chip LED chips, which shortens the heat dissipation path. The heat emitted by the LED chips is spread to the PCB through the solder paste. The heat dissipation effect is better than the normal SMD strips.

     2. Without the LED frame, all the light emitted by the wafer is refracted by the arc-shaped fluorescent colloid covered on the wafer surface and the highly reflective ink coated on the PCB surface achieving a maximum 180 ° viewing angle.

    3. Eliminate the resistor SMT process, fix the LED flip chip and resistors directly on the PCB through the solid crystal machine, which has high timeliness.

    4. Use flip chip on the strip which is much smaller than normal SMD LED, a larger number of flip chips can be laid on the PCB of the same length and width to achieve a more dense, continuous and dot-free light.

    Main specs

    Size
    (mm)
    Voltage
    (V)
    Chips/m Cutting interval(mm) Power/m
    (W)
    Copper thickness
    (um)
    Brightness(lm/m) RA
    1000*8mm DC24 512 62.5 10 35+35 900 >90
    1000*10mm DC24 512 62.5 10 35+35 900 >90

    Reliability test
    S/N Test items Test Qty     Test conditions Result Test equipment
    1 Aging at room temperature 5 meters 25±3℃,DC24V/1000hrs
    ,test parameters every 168hrs
    Light decay≤10%, No cracking, no failure
       
    Normal temperature aging table
    2 High temperature aging 5 meters 85±3℃,DC24V/1000hrs
    ,test parameters every 168hrs
    Light decay≤10%, No cracking, no failure
     
    High temperature aging chamber
    3 High temperature and humidity test 5 meters 85±3℃, 85±3% humidity, DC24V/1000hrs
    ,test parameters every 168hrs
    Light decay≤10%, No cracking, no failure

     
    High temperature and humidity aging chamber
    4 Thermal shock 5 meters -45℃/15min~105℃/15min Conversion time:30s/100 Cycle No cracking, no failure Thermal shock chamber

    Photometric Data
     
  • COB Flex

麻将血流成河怎么玩